Jay Gite
Senior Thermal Product Design Engineer NVIDIA
Seminars
Tuesday 22nd September 2026
Bridging Chip-to-Rack Constraints with Data Center Design to Enable AIReady Cooling
8:30 am
- Translating rising chip-to-rack power densities into facility design requirements to ensure your data center can seamlessly support current and next-generation AI workloads without costly retrofits
- Understanding and anticipating scaling constraints across thermal, power and liquid cooling systems to design infrastructure that is resilient, efficient and ready for higher density deployments
- Aligning server-level innovation with facility design strategies to close the gap between OEM requirements and data center capabilities, enabling faster deployment and future-proofed operations
