Case Study: Harnessing Modularization for Repeatable & Scalable Cooling Designs
10:30 am - Tuesday 22nd September 2026
- Designing modular, interchangeable cooling systems to adapt to evolving chip densities and enable flexible transitions between air and liquid cooling without overcommitting to a single approach
- Standardizing modular cooling architectures and design frameworks to reduce engineering complexity and accelerate deployment
- Integrating modularity into whole-of-facility design to ensure systems can be expanded, reconfigured or upgraded without major redesign
