Adapting Infrastructure to Next-Generation Hardware to Manage Thermal Loads & Future-Proof High-Density Data Centers
9:30 am - Wednesday 23rd September 2026
- Evaluating Vera Rubin chip thermal behaviour to design cooling systems that maintain performance and reliability over multiple years
- Adapting mechanical infrastructure for 800V DC systems to handle emerging processor architectures and high-power AI workloads
- Anticipating chip-driven thermal spikes to plan capacity, redundancy and lifecycle investments before deployment
